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Kurnal Insights
Deep research

Analysis Reports

Per-chip teardown PDFs covering process, packaging, and cell structure — all in one document.

Die Shot Analysis

<Not completed> Nvidia GPU SM DATA

Dieshot

2026-03-25 PDF
CMOS Analysis

Huawei Mate70Pro+CIS(SC580XS)+红枫镜头+UFS+LPDDR

CIS+UFS+LPDDR

2026-02-28 PDF
Die Shot Analysis

Xiaomi Xring Watch（T1）

基于Redmi Watch 5 ESIM版的 Xring 芯片分析

2026-02-23 PDF
Die Shot Analysis

MediaTek Dimensity 9500

基于天玑9500的片上分析与本世代产品对比

2026-02-23 PDF
Die Shot Analysis

Huawei Kirin 9020 analyze

基于华为Mate70Pro+的麒麟9020的片上分析

2026-02-23 PDF
Die Shot Analysis

Huawei KunPeng 930

封装分析+片上分析+工艺评估

2026-02-23 PDF
NAND / DRAM

Micron LPDDR5 24GB analyze

2026-02-23 PDF
Process Analysis

Samsung 3nm GAP Processor analyze

基于Exynos W1000的 三星3nm 工艺分析

2026-02-23 PDF
Process Analysis

Samsung 10nm/8nm processor analyze with Switch2(T239)

Samsung 10nm/8nm processor analyze with Switch2(T239)

2026-02-23 PDF
Die Shot Analysis

Apple C1+N1

Dieshot+SRAM

2026-02-23 PDF
Die Shot Analysis

Apple A19 Pro on chip analyze

Dieshot+SRAM

2026-02-23 PDF
Die Shot Analysis

Huawei-Car-Chip-990A&9610A V0.1

2026-02-22 PDF
Die Shot Analysis

Ascend910C-V1

2026-02-22 PDF
Die Shot Analysis

Switch2 analysis report

Switch2 芯片 Die Shot 深度解析

2026-02-22 PDF