Semiconductor Intelligence Platform
Depth · Precision · Professional
Engineering-grade semiconductor analysis: Die Shot, advanced packaging, CMOS process, memory and process node evolution.
- Reports
- 14
- Die Shots
- 145
- Manufacturers
- 16
· TSMC N3P Process Analysis · Samsung Exynos 2600 Report · NAND Stack Analysis · Micron LPDDR5X Package Teardown · Apple M4 Die Shot · NVIDIA Thor Architecture · Qualcomm Snapdragon 8 Elite Gen 5 · Intel Panther Lake H · TSMC N3P Process Analysis · Samsung Exynos 2600 Report · NAND Stack Analysis · Micron LPDDR5X Package Teardown · Apple M4 Die Shot · NVIDIA Thor Architecture · Qualcomm Snapdragon 8 Elite Gen 5 · Intel Panther Lake H
Latest insights
Blog & Articles
Industry observations, technical reviews and product updates from working engineers.
更新计划 2026-05-10
计算器恢复更新
逻辑密度与 SRAM 计算器已恢复，公式与参考数据已重新核对
Kurnal Insights
analyze 2026-03-09
为什么芯片的面积是这个数据——设计时的SPEC问题
分析与杂谈
Kurnal Insights
价格分析 2026-03-01
Apple M 系列单 Die 价格
M1 → M4 单 Die 制造成本估算
Kurnal Insights
更新计划 2026-02-28
2026 年 3 月视频更新计划
更新计划
Kurnal Insights
工艺分析 2026-02-24
TSMC N2P 工艺前瞻
TSMC N2P 工艺前瞻——基于 Synopsys 公开 PDK
Kurnal Insights
工艺分析 2026-02-23
Rapidus 2HP 工艺前瞻
基于 Synopsys 公开 PDK 的 Rapidus 2HP 数据分析
Kurnal Insights
Deep research
Analysis Reports
Per-chip teardown PDFs covering process, packaging, and cell structure — all in one document.
Die Shot Analysis
<Not completed> Nvidia GPU SM DATA
Dieshot
2026-03-25
PDF
CMOS Analysis
Huawei Mate70Pro+CIS(SC580XS)+红枫镜头+UFS+LPDDR
CIS+UFS+LPDDR
2026-02-28
PDF
Die Shot Analysis
Xiaomi Xring Watch（T1）
基于Redmi Watch 5 ESIM版的 Xring 芯片分析
2026-02-23
PDF
Die Shot Analysis
MediaTek Dimensity 9500
基于天玑9500的片上分析与本世代产品对比
2026-02-23
PDF
Die Shot Analysis
Huawei Kirin 9020 analyze
基于华为Mate70Pro+的麒麟9020的片上分析
2026-02-23
PDF
Die Shot Analysis
Huawei KunPeng 930
封装分析+片上分析+工艺评估
2026-02-23
PDF
Chip gallery
Dieshot Gallery
High-resolution die imagery, side-by-side across vendors, processes and eras. One click to zoom in.
