Latest insights
Blog & articles
Updates 2026-10-25
Two new tools: die layout and block harvesting yield
One tool explores how a die fits on a wafer. The other estimates how many dies can be recovered by disabling defective modules. Here is how to use them and how the calculations work.
Kurnal
Updates 2026-06-12
Updates and upcoming plans
Platform updates and plans for upcoming analysis.
Kurnal Insights
Updates 2026-05-10
Calculator updates are back
The logic density and SRAM calculators are back, with their formulas and reference data checked again.
Kurnal Insights
Analysis 2026-03-09
Why a chip has that exact die area — the design SPEC question
Thoughts on chip specifications, yield and die-area trade-offs.
Kurnal Insights
Cost Analysis 2026-03-01
Apple M-series cost per die
Estimated manufacturing cost per die, from M1 to M4.
Kurnal Insights
Updates 2026-02-28
March 2026 video plans
Planned videos for March 2026.
Kurnal Insights
Process Analysis 2026-02-24
A first look at TSMC N2P
A look at TSMC N2P using publicly available Synopsys PDK information.
Kurnal Insights
Process Analysis 2026-02-23
A first look at Rapidus 2HP
Rapidus 2HP process data inferred from publicly available Synopsys PDK information.
Kurnal Insights
Decapsulation 2026-02-23
Inside a hexagonal chip package (AS5621L)
A teardown of an unusual hexagonal chip package.
Kurnal Insights